BOA2 detects smaller defects
Sensor supports standard C-mount lenses to safeguard against accidental damage or tampering.
Teledyne DALSA’s next generation BOA2 smart camera captures defects that are difficult to resolve or are lost with lower resolution imagers. It delivers more pixels, power and greater integration flexibility for automating parts and assembly inspection with higher resolution imaging (2, 3 or 5 megapixels), dual-core processing and embedded iNspect Express application software.
For very high-speed applications, the CMOS sensor format can be changed to achieve inspection rates of up to 80 parts per second.
The sensor supports standard C-mount lenses, which, together with the optional LED light, enclose within a protective cover to safeguard against accidental damage or tampering.
The BOA2 is rated for use in harsh industrial environments and provides several mounting options on the front, back and side surfaces.
A high performance, 1.5 GHz dual core processing engine executes user configured solutions. System memory includes 2 GB of solution storage and 1 GB of program memory.
The embedded iNspect Express application software supports standard factory protocols, such as EthernetIP, Profinet and Modbus. The physical interfaces include Gigabit Ethernet, RS-232 serial, opto-isolated inputs and outputs.
Teledyne DALSA is a manufacturer of high performance digital imaging and semiconductors based in Waterloo, Ont.