Terepac to crank out micro circuits for the “Internet of Things”

Rockwell will help the Waterloo advanced manufacturer increase its production capacity.

June 11, 2012

WATERLOO, Ont.: Rockwell Automation will be working with Terepac Corp., a Waterloo, Ont. advanced manufacturer of tiny digital electronics, to produce large volumes of micro circuits for the “Internet of Things.”

Terepac miniaturizes electronics that print onto flexible substrates to create entire devices with microprocessors, memory and sensors, all of it measuring less than a millimetre square. According to the company’s website, they’re “thinner than paper and flexible enough to bend around a pencil – with no sacrifice in performance.”

Based on the agreement, Rockwell Automation, the global automation company based in Milwaukee, Wis., will support the infrastructure Terepac uses for its proprietary process.

No financial or technical details were released.

The company, which has a plant in Waterloo, Ont. and one in Dresden, Germany, will produce, with Rockwell’s help, large volumes of its micro circuits for the Internet of Things (uniquely identifiable objects and their virtual representations in an internet-like structure that requires radio frequency identification).

“Giving an electronic voice to an almost limitless number and type of objects can result in unpredecented gains in efficiency, insight and organizational change,” said Terepac CEO Ric Asselstine. “From health conditions to energy efficiency to more optimized industrial processes, we are learning the potential advances made possible by applying this technology.”

In April Terepac unveiled the TereTag, which allows virtually any object to become part of the Internet of Things. The company said the tag, embedded unobtrusively in its host, provides a wide range of capabilities to identify communicate and operate with more security and efficiency.